Low Silver Low Bismuth Assay Grade Lead Foil
Low silver low bismuth assay grade lead foil is a highly pure of form of lead foil tat is specifically manufactured to have a minimal amount of silver and bismuth. This type of lead foil is primarily used in the assaying process for precious metals, such as gold, where purity and precision are crucial. It is also employed in the semiconductor industry to ensure the integrity of manufacturing processes and final product.
Properties:
- • Silver content extremely low silver content (typically less than 0.05% by weight) to prevent contamination that could interfere with chemical reactions during assaying.
- • Bismuth content low bismuth content (often less than 0.01% by weight) to avoid issues with alloy formation and contamination that might affect the purity and accuracy of assay results.
- • Thickness the foil is available in various thicknesses, often ranging from 0.01 mm to 0.5mm, depending on the application needs.
- • Flexibility it is flexible and malleable, allowing it to be easily formed into sheets or other shapes as required.
- • Density lead has a high density (approximately 11.34 g/cm³), which contributes to its effectiveness in capturing and retaining gold during assaying.
- • Corrosion resistance lead foil is relatively resistant to corrosion but can be affected by acids and other reactive chemicals. It is usually handled in controlled environments to prevent corrosion.
- • Reactivity in assay processes, lead react with other elements to form alloys, which helps in separating and collecting precious metals.
Applications:
- • Fire assay lead foil is used in fire assay techniques to extract gold from ore samples. The foil is used to form a lead button with the gold, which is then separated from other materials.
- • Precise measurements high purity lead foil ensures that assay result is accurate and reliable, as contaminants could otherwise skew results.
- • Fluxing agent in the fire assay process, lead foil acts as a flux to collect gold and other precious metals from the ore samples.
- • Contaminations prevention low silver and low bismuth lead foil helps prevent contamination in semiconductor manufacturing, where even trace amounts of impurities can affect the performance of electronic components.
- • Lead soldering lead foil may be used in soldering processes in semiconductor assembly, where its purity ensures the reliability and functionality of the final product.
- • Protective shielding lead foil can be used in protective applications to shield sensitive electronic components from radiation or other environmental factors during manufacturing.